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HCS32MS bảng dữ liệu(PDF) 3 Page - Intersil Corporation |
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HCS32MS bảng dữ liệu(HTML) 3 Page - Intersil Corporation |
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3 / 11 page ![]() 3 FN3057.1 April 11, 2007 Absolute Maximum Ratings Thermal Information Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to VCC +0.5V DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA DC Drain Current, Any One Output . . . . . . . . . . . . . . . . . . . . ±25mA (All Voltage Reference to the VSS Terminal) Storage Temperature Range (TSTG). . . . . . . . . . . .-65°C to +150°C Lead Temperature (Soldering 10sec). . . . . . . . . . . . . . . . . . . +265°C Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Operating Conditions Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . 100ns/V Max Operating Temperature Range (TA). . . . . . . . . . . . .-55°C to +125°C Input Low Voltage (VIL) . . . . . . . . . . . . . . . . . . . 0.0V to 30% of VCC Input High Voltage (VIH) . . . . . . . . . . . . . . . . . .70% of VCC to VCC Thermal Resistance (Notes 1, 2) θJA θJC SBDIP Package . . . . . . . . . . . . . . . . . 74°C/W 24°C/W Ceramic Flatpack Package . . . . . . . . . 116°C/W 30°C/W Maximum Package Power Dissipation at +125°C Ambient SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.68W Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.43W If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.5mW/°C Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . .8.6mW/°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. For θ JC, the “case temp” location is the center of the exposed metal pad on the package underside. DC Electrical Electrical Performance Characteristics PARAMETER SYMBOL TEST CONDITIONS GROUP A SUBGROUPS TEMP (°C) LIMITS MIN MAX UNITS Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND 1+25 - 10 μA 2, 3 +125, -55 - 200 μA Output Current (Sink) IOL VCC = 4.5V, VIH = 4.5V, VOUT = 0.4V, VIL = 0V 1 +25 4.8 - mA 2, 3 +125, -55 4.0 - mA Output Current (Source) IOH VCC = 4.5V, VIH = 4.5V, VOUT = VCC -0.4V, VIL = 0V 1+25 -4.8 - mA 2, 3 +125, -55 -4.0 - mA Output Voltage Low VOL VCC = 4.5V, VIH = 3.15V, IOL = 50 μA, VIL = 1.35V 1, 2, 3 +25, +125, -55 - 0.1 V VCC = 5.5V, VIH = 3.85V, IOL = 50 μA, VIL = 1.65V 1, 2, 3 +25, +125, -55 - 0.1 V Output Voltage High VOH VCC = 4.5V, VIH = 3.15V, IOH = -50 μA, VIL = 1.35V 1, 2, 3 +25, +125, -55 VCC - 0.1 - V VCC = 5.5V, VIH = 3.85V, IOH = -50 μA, VIL = 1.65V 1, 2, 3 +25, +125, -55 VCC - 0.1 - V Input Leakage Current IIN VCC = 5.5V, VIN = VCC or GND 1+25 - ±0.5 μA 2, 3 +125, -55 - ±5.0 μA Noise Immunity Functional Test FN VCC = 4.5V, VIH = 0.70 (VCC), VIL = 0.30(VCC), (Note 3) 7, 8A, 8B +25, +125, -55 - - - NOTES: 3. This is just to show continuing notes in the document. 4. This is a row format electrical spec table. HCS32MS |
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