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5、电性规格 Specification

6、焊接和安装 Soldering and Mounting

6-1. Soldering

6.2 Solder re-flow:

6.3 Soldering Iron(Figure 2):

7、包装信息 Packaging Information

Part Number

Inductance(uH)

[100kHz/0.1V]

测量端

1--3，min

DC Resistance

(Ω)Max.

测量端

1--3

Q 值

测量端

1--3 min

绝缘电阻

(MΩ)

500V DC

测量端绕组～磁芯

min

耐电压

(VDC) ,1mA/3s

测量端绕组～绕组

) min

AP8066F-301L

300

1.0

3

100

1000

AP8066F-401L

400

1.0

3

100

1000

Series

Chip/Reel

Carton

8066F

1000

10000

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. FPE terminations are suitable for all wave and re-flow soldering systems.

If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event

that a soldering iron must be employed the following precautions are recommended.

‧Preheat circuit and products to 150℃

‧Never contact the ceramic with the iron tip

‧Use a 20 watt soldering iron with tip diameter of 1.0mm

‧350℃ tip temperature (max)

‧1.0mm tip diameter (max)

‧Limit soldering time to 4~5 sec.