http://www.sirenza.com

Phone: (800) SMI-MMIC

2

EDS-103295 Rev A

303 South Technology Court, Broomfield, CO 80021

SPF-2000 Low Noise High Linearity FET

Preliminary

Operation of this device beyond any one of these

parameters may cause permanent damage.

MTTF is inversely proportional to the device junction

temperature. For junction temperature and MTTF

considerations the operating conditions should also

satisfy the following experssions:

P

where:

P

P

T

T

R

Absolute Maximum Ratings

r

e

t

e

m

a

r

a

Pl

o

b

m

y

Se

u

l

a

Vt

i

n

U

n

i

a

r

Dt

n

e

r

r

u

CI

S

D

I

S

S

D

A

m

e

t

a

G

d

r

a

w

r

o

Ft

n

e

r

r

u

CI

F

S

G

3

.

0A

m

t

n

e

r

r

u

C

e

t

a

G

e

s

r

e

v

e

RI

R

S

G

3

.

0A

m

e

c

r

u

o

S

-

o

t

-

n

i

a

r

De

g

a

tl

o

VV

S

D

7

+V

n

i

a

r

D

-

o

t

-

e

t

a

Ge

g

a

tl

o

VV

D

G

8

-V

e

c

r

u

o

S

-

o

t

-

e

t

a

Ge

g

a

tl

o

VV

S

G

0

>

r

o

5

-

<V

r

e

w

o

P

t

u

p

n

I

F

RP

N

I

0

0

1W

m

e

r

u

t

a

r

e

p

m

e

T

g

n

it

a

r

e

p

OT

P

O

5

8

+

o

t

0

4

-C

°

e

g

n

a

R

e

r

u

t

a

r

e

p

m

e

T

e

g

a

r

o

t

ST

r

o

t

s

0

5

1

+

o

t

0

4

-C

°

n

o

it

a

p

i

s

s

i

D

r

e

w

o

PP

S

I

DS

0

0

6W

m

e

r

u

t

a

r

e

p

m

e

T

l

e

n

n

a

h

CT

J

+0

5

1C

°

Assembly Instructions:

The recommended die attach is conductive epoxy or AuSn (80/20) solder with limited exposure to

temperatures at or above 300C. The preferred wirebond method is thermo-compression wedge bond

using 0.7 mil gold wire with a maximum stage temperature of 200C. Aluminum wire should not be

used.

Design Data:

Complete design data including S-parameters, noise parameters, and large signal model are

available upon request by contacting applications support at baredie-apps@sirenza.com