1999 November

15

Philips Semiconductors

Product specification

Full Frame CCD Image Sensor

FTF3020-C

Package information

Figure 13 - Mechanical drawing of the PGA package of the FTF3020-C

A is the center of the image area.

Position of A:

26.35 ± 0.15 to left edge of package

20.00 ± 0.15 to upper edge of package

1.7 ± 0.15 to bottom of package

Angle of rotation: less than ± 1°

Sensor flatness: < 20 µm (P-V)

Cover glass: Corning 7059

Thickness of cover glass: 1 ± 0.05

Refractive index: n

Double sided AR coating < 1% (430-660 nm) reflection

All drawing units are in mm

Chip - bottom package 1.7 ±0.15

1.4 / 100

COVER GLASS

SENSOR CRYSTAL

Chip - cover glass 1.3 ±0.20

EPOXY GLUE

A

TOP VIEW

INDEX

MARK

PIN 1

(2.54)

STAND-OFF PIN

COVER GLASS

BOTTOM VIEW

Cover glass 1.0 ±0.05

Image sensor chip

Top cover glass to top chip 2.4 ±0.25