56F803 datasheet(2/57 Pages) FREESCALE

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Freescale Semiconductor, Inc.

Datasheet Addendum

This addendum identifies changes to Rev.16 of the 56F803 datasheet. The changes described in this

addendum have not been implemented in the specified pages.

Update the incomplete Thermal Design

Considerations section

Thermal Considerations section in 56F803 datasheet Rev.16 is incomplete. The complete Thermal

Design Consideration section should be as follows:

An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:

TJ = TA + (PD x RJA)

Eqn. 1

where:

TA = ambient temperature °C

RJA = package junction-to-ambient thermal resistance °C/W

PD = power dissipation in package

Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance

and a case-to-ambient thermal resistance:

RJA = RJC + RCA

Eqn. 2

Location: Section 5.1, Page 51

Document Number: DSP56F803AD

Rev. 0, 10/2015

Addendum to Rev. 16 of the 56F803

datasheet

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