BYG50M datasheet(2/6 Pages) PHILIPS

2 / 6 page

1996 May 24

Philips Semiconductors

Preliminary speciﬁcation

Controlled avalanche rectiﬁers

BYG50 series

FEATURES

• Glass passivated

• High maximum operating

temperature

• Low leakage current

• Excellent stability

• Guaranteed avalanche energy

absorption capability

• UL 94V-O classified plastic

package

• Shipped in 12 mm embossed tape.

DESCRIPTION

DO-214AC; SOD106 surface

mountable package with glass

passivated chip.

The well-defined void-free case is of a

transfer-moulded thermo-setting

plastic.

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

handbook, 4 columns

MSA474

Top view

Side view

cathode

band

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

VRRM

repetitive peak reverse voltage

BYG50D

−

200

BYG50G

−

400

BYG50J

−

600

BYG50K

−

800

BYG50M

−

1000

continuous reverse voltage

BYG50D

−

200

BYG50G

−

400

BYG50J

−

600

BYG50K

−

800

BYG50M

−

1000

IF(AV)

average forward current

averaged over any 20 ms

period; Ttp = 100 °C; see Fig.2

−

2.1

averaged over any 20 ms

period; Al2O3 PCB mounting (see

Fig.7); Tamb =60 °C; see Fig.3

−

1.0

averaged over any 20 ms

period; epoxy PCB mounting

(see Fig.7); Tamb =60 °C;

see Fig.3

−

0.7

IFSM

non-repetitive peak forward current

t = 10 ms half sinewave;

Tj =Tj max prior to surge;

VR =VRRMmax

−

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