WM8753LGEBSLASHV datasheet(91/92 Pages) WOLFSON

tên linh kiện	WM8753LGEB/V

Giải thích chi tiết về linh kiện	Hi-Fi and Telephony Dual CODEC

PDF	92 Pages

Scroll/Zoom	100%

nhà sản xuất	WOLFSON [Wolfson Microelectronics plc]

Trang chủ	http://www.wolfsonmicro.com

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91 / 92 page

WM8753L

Pre-Production

PP Rev 3.4 November 2005

PACKAGE DIAGRAM - 52-BALL BGA

DM034.A

B: 52 BALL BGA PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

0.10

2 X

DETAIL 2

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.

3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.

4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

0.27

0.21

0.15

0.35

0.25

5.00 BSC

4.00 BSC

0.50 BSC

5.00 BSC

4.00 BSC

0.30

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.95

1.11

1.27

0.80

0.90

1.00

ccc

0.10

2 X

aaa

bbb

DETAIL 1

SOLDER BALL

ddd

0.10

aaa

bbb

ccc

0.80

0.15

Tolerances of Form and Position

ddd

0.05

DETAIL 1

BOTTOM VIEW

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