32G431 datasheet(71/198 Pages) STMICROELECTRONICS

71 / 198 page

DS12589 Rev 6

71/198

STM32G431x6 STM32G431x8 STM32G431xB

Electrical characteristics

160

5.3

Operating conditions

5.3.1

General operating conditions

Table 17. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

170

MHz

fPCLK1

Internal APB1 clock frequency

170

fPCLK2

Internal APB2 clock frequency

170

VDD

Standard operating voltage

1.71(1)

3.6

VDDA

Analog supply voltage

ADC or COMP used

1.62

3.6

DAC 1 MSPS or DAC 15 MSPS

1.71

OPAMP used

2.0

3.6

VREFBUF used

2.4

3.6

ADC, DAC, OPAMP, COMP,

VREFBUF not used

VBAT

Backup operating voltage

1.55

3.6

VIN

I/O input voltage

TT_xx I/O

-0.3

VDD+0.3

FT_c I/O

-0.3

All I/O except TT_xx and FT_c

-0.3

MIN(MIN(VDD,

VDDA)+3.6 V,

5.5 V)(2)(3)

Power dissipation

See Section 6.10: Thermal characteristics for application

appropriate thermal resistance and package.

Power dissipation is then calculated according ambient

temperature (TA) and maximum junction temperature (TJ) and

selected thermal resistance.

Ambient temperature for the

suffix 6 version

Maximum power dissipation

-40

°C

Low-power dissipation(4)

-40

105

Ambient temperature for the

suffix 3 version

Maximum power dissipation

-40

125

Low-power dissipation(4)

-40

130

Junction temperature range

Suffix 6 version

-40

105

°C

Suffix 3 version

-40

130

1. When RESET is released functionality is guaranteed down to VBOR0 Min.

2. This formula has to be applied only on the power supplies related to the IO structure described by the pin definition table.

Maximum I/O input voltage is the smallest value between MIN(VDD, VDDA)+3.6 V and 5.5V.

3. For operation with voltage higher than Min (VDD, VDDA) +0.3 V, the internal Pull-up and Pull-Down resistors must be

disabled.

4. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 6.10:

Thermal characteristics).

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