SST39VF6401B datasheet(2/38 Pages) MICROCHIP

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DS20005008C

64 Mbit Multi-Purpose Flash Plus

SST39VF6401B / SST39VF6402B

Not Recommended for New Designs

Product Description

The SST39VF640xB devices are 4M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with

proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-

oxide tunneling injector attain better reliability and manufacturability compared with alternate

approaches. The SST39VF640xB write (Program or Erase) with a 2.7-3.6V power supply. These

devices conform to JEDEC standard pin assignments for x16 memories.

Featuring high performance Word-Program, the SST39VF640xB devices provide a typical Word-Pro-

gram time of 7 µsec. These devices use Toggle Bit or Data# Polling to indicate the completion of

Program operation. To protect against inadvertent write, they have on-chip hardware and Software

Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of applications,

these devices are offered with a guaranteed typical endurance of 100,000 cycles. Data retention is

rated at greater than 100 years.

The SST39VF640xB devices are suited for applications that require convenient and economical updat-

ing of program, configuration, or data memory. For all system applications, they significantly improve

performance and reliability, while lowering power consumption. They inherently use less energy during

Erase and Program than alternative flash technologies. The total energy consumed is a function of the

applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash

technology uses less current to program and has a shorter erase time, the total energy consumed

during any Erase or Program operation is less than alternative flash technologies. These devices also

improve flexibility while lowering the cost for program, data, and configuration storage applications.

The SuperFlash technology provides fixed Erase and Program times, independent of the number of

Erase/Program cycles that have occurred. Therefore the system software or hardware does not have

to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Pro-

gram times increase with accumulated Erase/Program cycles.

To meet high-density, surface mount requirements, the SST39VF640xB devices are offered in 48-lead

TSOP and 48-ball TFBGA packages. See Figures 22 and 3 for pin assignments.

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