NB650/NB650H

– 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS

NB650/NB650H Rev. 1.13

www.MonolithicPower.com

2

10/7/2019

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

Preliminary Specifications Subject to Change

© 2019 MPS. All Rights Reserved.

ORDERING INFORMATION

Part Number

Package

Top Marking

NB650GL*

QFN17 (3 x 4mm)

NB650

NB650HGL**

NB650H

* For Tape & Reel, add suffix

–Z (e.g. NB650GL–Z)

** For Tape & Reel, add suffix

–Z (e.g. NB650HGL–Z)

PACKAGE REFERENCE

TOP VIEW

SW

SW

IN

GND

GND

BST

PG

EN

VID1

VID2 VCC

AGND

SS

FREQ

RFB1

FB

RFB2

IN

GND

GND

SW

SW

1

2

3

4

8

7

6

5

9

10

11

12

13

14

15

16

17

EXPOSED PAD

ON BACKSIDE

QFN17 (3x4mm)

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN .......................................28V

VSW .......................................-0.3V to VIN + 0.3V

VSW .............................-3V to VIN + 3V for <30ns

VBST .....................................................VSW + 6V

All Other Pins................................. -0.3V to +6V

Continuous Power Dissipation

(TA = +25°C) (2)

QFN17

….………………………

……….2.4W

Junction Temperature .............................. 150°C

Lead Temperature ................................... 260°C

Storage Temperature............... -65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ....................... 4.5V to 22.5V

Output Voltage VOUT........................ 0.6V to 13V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN17(3 x 4mm)....................52 .... 11 ..°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX),

the junction-to-

ambient therm

al resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.