7 Specifications

7.1 Absolute Maximum Ratings: TMUX821x Devices

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD–VSS

Supply voltage

110

V

VDD

–0.5

110

V

VSS

–110

0.5

V

VSELx

Logic control input pin voltage (SELx)

–0.5

50

V

ISELx

Logic control input pin current (SELx)

–30

30

mA

VS or VD

Source or drain voltage (Sx, Dx)

VSS–2

VDD+2

V

IDC

Source or drain continuous current (Sx, Dx)

–200

200

mA

IIK (2)

Diode clamp current at 85°C

–100

100

mA

Diode clamp current at 125°C

–15

15

mA

Tstg

Storage temperature

–65

150

°C

TA

Ambient temperature

–55

150

°C

TJ

Junction temperature

150

°C

Ptot (3)

Total power dissipation (QFN)

1680

mW

Ptot (4)

Total power dissipation (TSSOP)

720

mW

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

Signal path pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum

ratings.

(3)

For QFN package: Ptot derates linearly above TA = 70°C by 24.0 mW/°C

(4)

For TSSOP package: Ptot derates linearly above TA = 70°C by 10.5 mW/°C

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions: TMUX821x Devices

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD – VSS (1) Power supply voltage differential

10

100

V

VDD

Positive power supply voltage

10

100

V

VS or VD (2)

Signal path input/output voltage (source or drain pin)

VSS

VDD

V

VSEL

Logic input pin voltage

0

48

V

TA

Ambient temperature

–40

125

°C

IS or ID (CONT) Source or drain continuous current (Sx, D)

IDC (3)

mA

(1)

VDD and VSS can be any value as long as 10 V ≤ (VDD – VSS) ≤ 100 V, and the minimum VDD is met.

(2)

VS or VD is the voltage on any Source or Drain pins.

(3)

Refer to Source or Drain Continuous Current table for IDC specifications.

TMUX8211, TMUX8212, TMUX8213

SCDS434B – OCTOBER 2021 – REVISED MARCH 2023

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