CS8161 datasheet(9/11 Pages) ONSEMI

9 / 11 page

CS8161

http://onsemi.com

Heat Sinks

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

determine the value of RqJA:

qJA + RqJC ) RqCS ) RqSA

(3)

where:

RqJC = the junction−to−case thermal resistance,

RqCS = the case−to−heatsink thermal resistance, and

RqSA = the heatsink−to−ambient thermal resistance.

RqJC appears in the package section of the data sheet. Like

RqJA, it too is a function of package type. RqCS and RqSA are

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

MARKING DIAGRAMS

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

TO−220 5−LEAD

8161

AWLYWWG

CS8161

AWLYWWG

8161

AWLYWWG

ORDERING INFORMATION*

Device

Package

Shipping

CS8161YT5

TO−220

STRAIGHT

50 Units / Rail

CS8161YT5G

TO−220

STRAIGHT

(Pb−Free)

CS8161YTVA5

TO−220

VERTICAL

CS8161YTVA5G

TO−220

VERTICAL

(Pb−Free)

CS8161YTHA5

TO−220

HORIZONTAL

CS8161YTHA5G

TO−220

HORIZONTAL

(Pb−Free)

*Consult your local sales representative for SO−16L package option.

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