TS4956 datasheet(47/51 Pages) STMICROELECTRONICS

tên linh kiện	TS4956

Giải thích chi tiết về linh kiện	Stereo audio amplifier system with I2C bus interface

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TS4956

Package mechanical data

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

5.1

18-bump flip-chip package

Figure 134. Footprint recommendations

Die size: 2.5x2.4 mm ± 30µm

Die height (including bumps): 600µm

Bumps diameter: 315µm ±50µm

Bump diameter before reflow: 300µm ±10µm

Bumps height: 250µm ±40µm

Die height: 350µm ±20µm

Pitch: 500µm ±50µm

Coplanarity: 50µm max

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