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AD5821 bảng dữ liệu(PDF) 13 Page - Analog Devices |
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AD5821 bảng dữ liệu(HTML) 13 Page - Analog Devices |
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13 / 16 page ![]() AD5821 Rev. 0 | Page 13 of 16 When sinking the maximum current of 120 mA, the maximum voltage drop allowed across RSENSE is 400 mV, and the minimum drain to source voltage of Q1 is 200 mV. This means that the AD5821 output has a compliance voltage of 600 mV. If VDROP falls below 600 mV, the output transistor, Q1, can no longer operate properly and ISINK may not be maintained as a constant. When sinking 90 mA, the maximum voltage drop allowed across RSENSE is 300 mV, and the minimum drain to source voltage of Q1 is 180 mV. This means that the AD5821 output has a compliance voltage of 480 mV. If VDROP falls below 480 mV, the output transistor, Q1, can no longer operate properly and ISINK may not be maintained as a constant. As ISINK decreases, the voltage required across the transistor, Q1, also decreases and, therefore, lower supplies can be used with the voice coil motor. As the current increases to 120 mA through the voice coil, VC increases. VDROP decreases and eventually approaches the minimum specified compliance voltage of 600 mV (or 480 mV, if ISINK = 90 mA). The ground return path is modeled by the components RG and LG. The track resistance between the voice coil and the AD5821 is modeled as RT. The inductive effects of LG influence RSENSE and RC equally, and because the current is maintained as a constant, it is not as critical as the purely resistive component of the ground return path. When the maximum sink current is flowing through the motor, the resistive elements, RT and RG, may have an impact on the voltage headroom of Q1 and could, in turn, limit the maximum value of RC because of voltage compliance. For example, if VBATTERY = 3.6 V RG = 0.5 Ω RT = 0.5 Ω ISINK = 120 mA VDROP = 600 mV (the compliance voltage) Then the largest value of resistance of the voice coil, RC, is = × + × + − = SINK G SINK T SINK DROP BAT C I R I R I V V R )] ( ) ( [ Ω 24 mA 120 Ω)] 0.5 mA (120 2 mV [600 V 3.6 = × × + − Using another example, if VBATTERY = 3.6 V RG = 0.5 Ω RT = 0.5 Ω ISINK = 90 mA VDROP = 480 mV (the compliance voltage specification at 90 mA) Then the largest value of resistance of the voice coil, RC, is = × + × + − = SINK G SINK T SINK DROP BAT C I R I R I V V R )] ( ) ( [ Ω 33.66 mA 90 Ω)] 0.5 mA (90 2 mV [480 V 3.6 = × × + − For this reason, it is important to minimize any series impedance on both the ground return path and interconnect between the AD5821 and the motor. It is also important to note that for lower values of ISINK, the compliance voltage of the output stage also decreases. This decrease allows the user to either use voice coil motors with high resistance values or decrease the power supply voltage on the voice coil motor. The compliance voltage decreases as the ISINK current decreases. The power supply of the AD5821, or the regulator used to supply the AD5821, should be decoupled. Best practice power supply decoupling recommends that the power supply be decoupled with a 10 μF capacitor. Ideally, this 10 μF capacitor should be of a tantalum bead type. However, if the power supply or regulator supply is well regulated and clean, such decoupling may not be required. The AD5821 should be decoupled locally with a 0.1 μF ceramic capacitor, and this 0.1 μF capacitor should be located as close as possible to the VDD pin. The 0.1 μF capacitor should be ceramic with a low effective series resistance and effective series inductance. The 0.1 μF capacitor provides a low impedance path to ground for high transient currents. The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals, if possible. When traces cross on opposite sides of the board, they should run at right angles to each other to reduce feedthrough effects through the board. The best technique is to use a multilayer board with ground and power planes, where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board. |
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