3

®

OPA627, 637

PIN CONFIGURATIONS

DIP/SOIC

Top View

Offset Trim

–In

+In

–V

No Internal Connection

+V

Output

Offset Trim

S

S

1

2

3

4

8

7

6

5

Top View

TO-99

Offset Trim

–In

Output

Offset Trim

+In

–V

S

+V

S

No Internal Connection

Case connected to –V

8

1

2

3

4

5

6

7

Supply Voltage ..................................................................................

±18V

Power Dissipation ........................................................................ 1000mW

Operating Temperature

M Package .................................................................. –55

°C to +125°C

P, U Package ............................................................. –40

°C to +125°C

Storage Temperature

M Package .................................................................. –65

°C to +150°C

P, U Package ............................................................. –40

°C to +125°C

Junction Temperature

M Package .................................................................................. +175

°C

P, U Package ............................................................................. +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

SOlC (soldering, 3s) ................................................................... +260

°C

NOTE: (1) Stresses above these ratings may cause permanent damage.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

PACKAGE/ORDERING INFORMATION

PACKAGE DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

OPA627AP

Plastic DIP

006

–25

°C to +85°C

OPA627BP

Plastic DIP

006

–25

°C to +85°C

OPA627AU

SOIC

182

–25

°C to +85°C

OPA627AM

TO-99 Metal

001

–25

°C to +85°C

OPA627BM

TO-99 Metal

001

–25

°C to +85°C

OPA627SM

TO-99 Metal

001

–55

°C to +125°C

OPA637AP

Plastic DIP

006

–25

°C to +85°C

OPA637BP

Plastic DIP

006

–25

°C to +85°C

OPA637AU

SOIC

182

–25

°C to +85°C

OPA637AM

TO-99 Metal

001

–25

°C to +85°C

OPA637BM

TO-99 Metal

001

–25

°C to +85°C

OPA637SM

TO-99 Metal

001

–55

°C to +125°C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.