OPA1632

SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006

www.ti.com

2

PRODUCT

PACKAGE-LEAD

PACKAGE

DRAWING

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

SO-8

D

−40

°C to +85°C

OPA1632

OPA1632D

Rails, 100

OPA1632

SO-8

D

−40

°C to +85°C

OPA1632

OPA1632DR

Tape and Reel, 2500

OPA1632

MSOP-8

DGN

−40

°C to +85°C

1632

OPA1632DGN

Rails, 100

MSOP-8

PowerPAD

DGN

−40

°C to +85°C

1632

OPA1632DGNR

Tape and Reel, 2500

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

over operating free-air temperature range unless otherwise noted.

Supply Voltage,

±VS

±16.5V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input Voltage, VI

±VS

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output Current, IO

150mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential Input Voltage, VID

±3V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature, TJ

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Free-Air Temperature Range

−40

°C to +85°C

. . . . . . . . . . . . . . .

Storage Temperature Range, TSTG

−65

°C to +150°C

. . . . . . . . . . . . . . . . .

ESD Ratings: Human Body Model

1kV

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charge Device Model

500V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

Machine Model

200V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

(2) The OPA1632 MSOP-8 package version incorporates a

PowerPAD on the underside of the chip. This acts as a heatsink

and must be connected to a thermally dissipative plane for proper

power dissipation. Failure to do so may result in exceeding the

maximum junction temperature, which can permanently damage

the device. See TI technical brief SLMA002 for more information

about using the PowerPAD thermally enhanced package.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PIN CONFIGURATION

Top View

MSOP, SO

1

2

3

4

8

7

6

5

V

IN+

Enable

V

−

V

OUT

−

V

IN

−

V

OCM

V+

V

OUT+

OPA1632