ZXMN7A11K datasheet(2/8 Pages) ZETEX

2 / 8 page

ZXMN7A11K

Issue 2 - August 2006

www.zetex.com

Absolute maximum ratings

NOTES:

(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in

still air conditions.

(b) For a device surface mounted on FR4 PCB measured at t

10 sec.

junction temperature.

(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in

still air conditions.

Parameter

Symbol

Limit

Unit

Drain-source voltage

VDSS

Gate-source voltage

VGS

±20

Continuous drain current

@ VGS=10V; TA=25°C (b)

@ VGS=10V; TA=70°C (b)

@ VGS=10V; TA=25°C (a)

6.1

4.9

4.2

Pulsed drain current (c)

IDM

Continuous source current (body diode) (b)

8.7

Pulsed source current (body diode) (c)

ISM

Power dissipation at TA =25°C (a)

Linear derating factor

4.06

32.4

mW/°C

Power dissipation at TA =25°C (b)

Linear derating factor

8.5

mW/°C

Power dissipation at TA =25°C (d)

Linear derating factor

2.11

16.8

mW/°C

Operating and storage temperature range

Tj, Tstg

-55 to +150

°C

Thermal resistance

Parameter

Symbol

Limit

Unit

Junction to ambient

R JA

30.8

°C/W

Junction to ambient

R JA

14.7

°C/W

Junction to ambient

R JA

59.1

°C/W

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