µPD16837

12

Data Sheet S12764EJ2V0DS

RECOMMENDED SOLDERING CONDITIONS

The

µ PD16837 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Surface Mount Device

30-PIN PLASTIC SSOP (7.62 mm (300) )

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C; Time: 30 secs. MAX. (210 °C MIN.);

IR35-00-3

Number of times: 3 times MAX.; Number of days: noneNote; Flux:

Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% MAX.)

is recommended.

VPS

Package peak temperature: 215

°C; Time: 40 secs. MAX. (200 °C MIN.);

VP-15-00-3

Number of times: 3 times MAX.; Number of days: noneNote; Flux:

Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% MAX.)

is recommended.

Wave soldering

Package peak temperature: 260

°C; Time: 10 secs. MAX.; Number of

WS60-00-1

times: once; Flux: Rosin-based flux with little chlorine content

(chlorine: 0.2 Wt% MAX.) is recommended.

Note

Number of days in storage after the dry pack has been opened. The storage conditions are at 25

°C, 65%

RH MAX.

Caution

Do not use two or more soldering methods in combination.