© Semiconductor Components Industries, LLC, 2018

July, 2021 − Rev. 1

1

Publication Order Number:

ESDM3032/D

ESD Protection Diode

Micro−Packaged Diodes for ESD Protection

ESDM3032

The ESDM3032 is designed to protect voltage sensitive components

that require low capacitance from ESD and transient voltage events.

Excellent clamping capability, low capacitance, low leakage, and fast

response time, make these parts ideal for ESD protection on designs

where board space is at a premium.

Features

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.62 mm x 0.32 mm

• Low Body Height: 0.3 mm

• Stand−off Voltage: 3.3 V

• IEC61000−4−2 Level 4 ESD Protection

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• mSD Card Protection

• Audio Line

• GPIO

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

±30

±30

kV

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

°PD°

RqJA

250

400

mW

°C/W

Junction and Storage Temperature Range

TJ, Tstg

−55 to +150

°C

Lead Solder Temperature − Maximum

(10 Second Duration)

TL

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Device

Package

Shipping†

ORDERING INFORMATION

www.onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

ESDM3032MXT5G

X3DFN2

(Pb−Free)

10000 / Tape &

Reel

X3DFN2

CASE 152AF

MARKING

DIAGRAM

3

= Specific Device Code

M = Date Code

1

2

PIN 1

3 M