Data Sheet S11032EJ4V0DS

11

µµµµPD16805

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this under the conditions described below.

For soldering methods and conditions other than those listed below, consult NEC.

For details of the recommended soldering conditions, refer to information document “Semiconductor Device

Mounting Technology Manual”.

µPD16805GS

Soldering Method

Soldering Conditions

Recommended

Conditions Symbol

Infrared reflow

Peak package temperature: 235

°C, Time: 30 seconds MAX. (210°C MIN.),

Number of times: 2 MAX.

IR35-00-2

VPS

Peak package temperature: 215

°C, Time: 40 seconds MAX. (200°C MIN.),

Number of times: 2 MAX.

VP15-00-2

The number of storage days at 25

°C, 65% RH after the dry pack has been opened

µPD16805MA-6A5

Soldering Method

Soldering Conditions

Recommended

Conditions Symbol

Infrared reflow

Package peak temperature: 235

°C; Duration: 30 sec. max. (210°C or above):

Number of times: Max. 3; Time limit: None

Note

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is

recommended.

IR35-00-3

VPS

Package peak temperature: 215

°C; Duration: 40 sec. max. (200°C or above):

Number of times:3; Time limit: None

Note

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is

recommended.

VP15-00-3

Wave soldering

Package peak temperature: 260

°C or less, Duration: 10 sec. Max.,.

Preparatory heating temperature: 120

°C or less; Number of times: 1

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is

recommended.

WS60-00-1

Note The number of storage days at 25

°C, 65% RH after the dry pack has been opened

Caution Use of more than one soldering method should be avoided.