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MCP16331 bảng dữ liệu(PDF) 40 Page - Microchip Technology

tên linh kiện MCP16331
Giải thích chi tiết về linh kiện  High-Voltage Input Integrated Switch Step-Down Regulator
PDF  48 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP16331 bảng dữ liệu(HTML) 40 Page - Microchip Technology

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MCP16331
DS20005308D-page 40
 2014-2021 Microchip Technology Inc.
Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 2 of 2
8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOM
MILLIMETERS
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Contact-to-Exposed Pad
Contact Thickness
Exposed Pad Width
Exposed Pad Length
4. Dimensioning and tolerancing per ASME Y14.5M
3. Package is saw singulated
2. Package may have one or more exposed tie bars at ends.
Notes:
Contact Width
Overall Width
Overall Length
Contact Length
Standoff
Number of Pins
Overall Height
Pitch
K
0.20
Units
N
e
A
Dimension Limits
D
A3
A1
b
D2
E2
E
L
0.20
1.35
1.25
0.25
0.00
0.70
MIN
-
-
0.25
0.30
1.30
1.40
1.35
0.30
0.45
1.45
8
0.75
0.02
0.05
0.80
MAX
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)



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