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-3 -

SOLDER ABILITY

Item

Requirement

Test Condition

Solder-ability

The inspected area of

each lead must have 95%

solder coverage min.

JESD22-B102D,Condition C

Steam aging Preconditioning: 93+3/-5°C, 8 hours

±

15 minute

For SMT:

Solder temperature:245± 5°C.

Solder immersion time:5±0.5s

Soldering heat

withstanding

Inspect dimension during

the test, no physical

damage

Reflow soldering (Infrared):

Refer soldering method

Recommended Infrared Reflow Condition:

Fig.1