The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -

contact

Resistance 40 mΩ Max

No physical damage to

connector shall occur.

Duration: 250 hours

EIA364-17

Low Temperature

Resistance

Max. Change from initial

contact

Resistance 40 mΩ Max

No physical damage to

connector shall occur.

Chamber Temperature: - 40±2°C

Duration: 96 hours

Dummy card engaged during test

EIA364-59

Salt Spray Test

Max. Change from initial

contact

Resistance 40 mΩ Max

No physical damage to

connector shall occur.

Salt Solution: 5±1.0%

Length of Test: 48 hours

Dummy card engaged during test

EIA364-26

SOLDER ABILITY

Item

Requirement

Test Condition

Solder ability

Wet Solder Coverage:

95% Min.

Solder Temperature: 245±3°C

Immersion Duration: 3 ±0.5 sec.

Solder: Sn-3Ag-0.5Cu

Flux: RMA 25%

Solder-Heat Resistance

No evidence of

deformation or

fusion of housing and no

physical damage after

test.

Refer to Reflow Profile

FIGURE I: CONTACT RESISTANCE