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HSMP-381F bảng dữ liệu(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HSMP-381F bảng dữ liệu(HTML) 8 Page - Agilent(Hewlett-Packard) |
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8 / 12 page ![]() 8 Figure 21. Internal Connections. 12 3 12 3 HSMP-489B HSMP-481B Typical Applications for HSMP-48XX Low Inductance Series Figure 22. Circuit Layout. Microstrip Series Connection for HSMP-48XB Series In order to take full advantage of the low inductance of the HSMP-48XB series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in Figure 21. Microstrip Shunt Connections for HSMP-48XB Series In Figure 23, the center conductor of the microstrip line is inter- rupted and leads 1 and 2 of the HSMP-48XB series diode are placed across the resulting gap. This forces the 0.5 nH lead induc- tance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and increasing the maximum available attenuation. The 0.3 nH of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material. Figure 23. Circuit Layout. 50 OHM MICROSTRIP LINES PAD CONNECTED TO GROUND BY TWO VIA HOLES 0.3 nH 0.3 nH 0.3 pF* 1.5 nH 1.5 nH *0.8 pF TYPICAL FOR HSMP-482B Figure 24. Equivalent Circuit. |
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