µPC8102T

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NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

(3) Keep the track length of the ground pins as short as possible.

(4) The bypass capacitor (eg 1 000 pF) should be attached to the VCC pin.

(5) The matching circuit must be each attached to input and output pins.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and conditions

than the recommended conditions are to be consulted with our sales representatives.

µPC8102T

Soldering process

Soldering conditions

Recommended condition

symbol

Infrared ray reflow

Package peak temperature: 235 ˚C,

IR35-00-3

Hour: within 30 s. (more than 210 ˚C),

Time: 3 time, Limited days: no.*

VPS

Package peak temperature: 215 ˚C,

VP15-00-3

Hour: within 40 s. (more than 200 ˚C),

Time: 3 time, Limited days: no.*

Wave Soldering

Soldering tub temperature: less than 260 ˚C, Hour: within 10 s.

WS60-00-1

Time: 1 time, Limited days: no.*

Pin part heating

Pin area temperature: less than 300 ˚C, Hour: within 3 s/pin.

Limited days: no.*

* It is the storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 % RH.

Note

The combined use of soldering method is to be avoided (However, except the pin area heating method).

For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-

DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00).