12

µPC2400A Series

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

TYPES OF THROUGH HOLE MOUNT DEVICE

µPC2400AHF Series

Soldering Process

Soldering Conditions

Symbol

Wave soldering

Solder temperature: 260 ˚C or below.

Flow Time: 10 seconds or below.

REFERENCE

Document Name

Document No.

NEC semiconductor device reliability/quality control system.

IEI-1212

Quality grade on NEC semiconductor devices.

IEI-1209

Semiconductor device mounting technology manual.

IEI-1207

Semiconductor device package manual.

IEI-1213

Guide to quality assurance for semiconductor devices.

MEI-1202

Semiconductor selection guide.

MF-1134