Data Sheet G14309EJ2V0DS00

32

µµµµPC1909

6. RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is performed under different conditions, please make sure to consult with our

sales offices.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"(C10535E).

Type of Through-hole Device

µµµµPC1909CX: 16-pin plastic DIP (7.62 mm (300))

Soldering Method

Soldering Conditions

Wave soldering (pins only)

Solder bath temperature : 260

°C MAX., Time : 10 seconds MAX.

Partial heating

Pin temperature : 300

°C MAX., Time : 3 seconds MAX. (per pin)

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

Type of Surface Mount Device

µµµµPC1909GS: 16-pin plastic SOP (7.62 mm (300))

Soldering Method

Soldering Conditions

Recommended

Condition symbol

Infrared reflow

Package peak temperature : 235

°C, Time : 30 seconds MAX.

(at 210

°C or higher), Count : Twice or less

IR35-00-2

VPS

Package peak temperature : 215

°C, Time : 40 seconds MAX.

(at 200

°C or higher), Count : Twice or less

VP15-00-2

Wave soldering

Soldering bath temperature : 260

°C or less, Time : 10 seconds

MAX., Count : Once, Preheating temperature : 120

°C MAX.

(package surface temperature)

WS60-00-1

Caution Do not use different soldering methods together.