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SM0807RGB bảng dữ liệu(PDF) 3 Page - Bivar, Inc. |
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SM0807RGB bảng dữ liệu(HTML) 3 Page - Bivar, Inc. |
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3 / 6 page ![]() Soldering Iron: 1. Temperature at tip of iron: 300̊C Max. (25W Max) 2. Soldering Time: 5 ± 1 sec. Precautions for Use: Customer must apply resistors for protection otherwise slight voltage shift will cause big current change, causing burnout. Circuit Design 1. Customer must apply resistors for protection and stability. Circuit B in the diagram below is recommended. If Circuit A is used, the current through the LEDs may vary due to the variation in Forward Voltage characteristics of the LEDs, causing burn out to happen. 2. Current change may lead to LED color change. If there is a big difference among spectral color separation current and actual service current, a color difference may occur. 3. This product should be operated using forward current. Subjecting it to continuous reverse voltage may cause migration, which may cause damage to the LED die. Handling Precautions 1. When handling the product with tweezers, be careful to not apply excessive force to the resin. Otherwise, the resin can be cut, chipped, delaminate, or deformed, causing wire-bond breaks. 2. Reflow Soldering must not be performed more than twice. Hand soldering must not be performed more than once. 3. When soldering, do not put stress on the LEDs during heating. 4. The product is sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. 5. Do not stack assembled PCBs together. Stacking assembled PCBs can cause the resin to chip, delaminate, and/or deform. This may lead to failure. Bivar reserves the right to make changes at any time without notice. Bivar, Inc. — 4 Thomas, Irvine, California 92618, U.S.A. Revision A 8/21 Phone: (949) 951-8808 Fax: (949) 951-3974 E-mail: bivar@bivar.com Web: www.bivar.com Page 3 of 6 |
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