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NTS0102DP125 bảng dữ liệu(PDF) 17 Page - NXP Semiconductors |
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NTS0102DP125 bảng dữ liệu(HTML) 17 Page - NXP Semiconductors |
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17 / 43 page  NXP Semiconductors NTS0102 Dual supply translating transceiver; open-drain; auto direction sensing 2. New use of the TL package: Place PCB trace for soldering of the center pad based on PCB layout recommendations for better mechanical connection and thermal conductivity. The PCB center pad can be connect to GND or left floating. • Trace under the GD package 1. Replacement of GD package: It is not best practice to have center pad over the trace but since the TL package center pad is not connected to the silicon the risk is low. If there are multiple traces there could be EMI and cross talk. In both cases the customer needs to evaluate risk. 2. New use of the TL package: Do not route traces under the package NTS0102 All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 4.5 — 6 July 2023 17 / 43 |
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