FS8855-18CE datasheet(4/13 Pages) ETC1

4 / 13 page

FS8855

500mA LDO Linear Regulator

Fortune Semiconductor Co.

TEL : +886-2-2809-4742

4/13

TD-0405007

Rev. 1.4

http://www.fsc.com.tw

FAX: +886-2-2809-4874

Tyyp

piiccaall A

plliiccaattiioon

n C

Ciirrccu

uiitt

bssoollu

uttee M

Maaxxiim

m R

Raattiin

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Input voltage VIN to GND -------------------------------------------------------------------------------------------------- 10V

Output current limit, I(LIMIT) -------------------------------------------------------------------------------------------------- 0.8A

Continuous power dissipation, PD (∆T= TJ -TA = 100°C)

SOT-223 ---------------------------------------------------------------------------------------------------------------------------------------- 0.65W

SOT-89

----------------------------------------------------------------------------------------------------------------------------------------

0.55W

TO-92

----------------------------------------------------------------------------------------------------------------------------------------

0.55W

* The power dissipation values are based on the condition that junction temperature TJ and ambient

temperature TA difference is 100°C.

Junction Temperature, TJ ----------------------------------------------------------------------------------------------- +155°C

Storage temperature range, TSTG ---------------------------------------------------------------------- -55℃ to +150°C

Operating junction temperature range ---------------------------------------------------------------- -40℃ to +125°C

Lead temperature (soldering, 10sec) ------------------------------------------------------------------------------- 260°C

* Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device.

These are stress ratings only, and function operation of the device at these or any other conditions beyond those

indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliability.

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