AD9889B

Preliminary Technical Data

Rev. PrA | Page 12 of 12

*COMPLIANT TO JEDEC STANDARDS MO-225

WITH THE EXCEPTION TO PACKAGE HEIGHT.

A

B

C

D

E

F

G

J

H

K

10

8

7

6

3

2

1

9

5

4

A1 CORNER

INDEX AREA

TOP VIEW

BALL A1

PAD CORNER

DETAIL A

BOTTOM VIEW

0.75

REF

6.10

6.00 SQ

5.90

SEATING

PLANE

DETAILA

BALL DIAMETER

0.15 MIN

0.35

0.30

0.25

COPLANARITY

0.08 MAX

0.65 MIN

0.50

BSC

4.50

BSC SQ

*1.40 MAX

Figure 8. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

6 mm × 6 mm × 1.4 mm

(BC-76)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD9889BBCPZ-801

−25°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP]

CP-64-1

AD9889BBCPZ-1651

−25°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP]

CP-64-1

AD9889BBSTZ-801

−25°C to +85°C

100-Lead Low Profile Quad Flat Package [LQFP]

ST-80-2

AD9889BBSTZ-1651

−25°C to +85°C

100-Lead Low Profile Quad Flat Package [LQFP]

ST-80-2

AD9889BBBCZ-801

−25°C to +85°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76

AD9889BBBCZ-1651

−25°C to +85°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76

AD9889BBBCZRL-801

−25°C to +85°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76

AD9889BBBCZRL-1651

−25°C to +85°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76

AD9889B/PCB

Evaluation Board

©2006 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

PR06291-0-11/06(PrA)