AD8336ACPZ-R7 datasheet(28/28 Pages) AD

28 / 28 page

AD8336

Rev. 0 | Page 28 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

2.25

2.10 SQ

1.95

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.35

0.30

0.25

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

PIN 1

INDICATOR

0.25 MIN

0.75

0.60

0.50

THE EXPOSED PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY, IT IS RECOMMENDED

THAT THE PADDLE BE SOLDERED TO THE

GROUND PLANE.

Figure 90. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8336ACPZ1

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

AD8336ACPZ-R71

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

AD8336ACPZ-RL1

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

AD8336ACPZ-WP1

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-4

AD8336-EVALZ1

Evaluation Board

1 Z = Pb-free part.

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D06228-0-10/06(0)

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