2000 Sep 05

11

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

PACKAGE OUTLINE

UNIT

bp

c

Q

L2

L1

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

1.7

1.4

0.8

0.7

bp1

1.57

1.47

5.7

5.5

4.1

3.9

0.3

0.24

1.2

0.9

3.9

3.5

L3

6.55

6.35

M1

5.65

5.35

M2

5.65

5.35

M3

(1)

3.15

2.85

L

7.55

7.25

(2)

3.15

2.95

D2

(2)

4.5

4.3

5.7

5.5

4.6

4.4

E1

(2)

18.2

17.8

HE

5.6

5.5

HE1

K

max.

3.87

e

0.25

0.75

0.65

DIMENSIONS (mm are the original dimensions)

SOT453C

99-09-23

00-08-31

0

2.5

5 mm

scale

Plastic single-ended multi-chip package;

magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads

SOT453C

e

E

E1

HE1

L1

D

L

bp1

D1

D2

L3

HE

M1

Notes

1. Glue thickness not included.

2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

L2

bp

c

12

Q

A

K

M2

M3

B

A

SENSOR DIE POSITION

*

centre of reading point