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ADV7342 bảng dữ liệu(PDF) 17 Page - Analog Devices |
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ADV7342 bảng dữ liệu(HTML) 17 Page - Analog Devices |
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17 / 88 page ![]() ADV7342/ADV7343 Rev. 0 | Page 17 of 88 ABSOLUTE MAXIMUM RATINGS Table 11. Parameter1 Rating VAA to AGND −0.3 V to +3.9 V VDD to DGND −0.3 V to +2.3 V PVDD to PGND −0.3 V to +2.3 V VDD_IO to GND_IO −0.3 V to +3.9 V VAA to VDD −0.3 V to +2.2 V VDD to PVDD −0.3 V to +0.3 V VDD_IO to VDD −0.3 V to +2.2 V AGND to DGND −0.3 V to +0.3 V AGND to PGND −0.3 V to +0.3 V AGND to GND_IO −0.3 V to +0.3 V DGND to PGND −0.3 V to +0.3 V DGND to GND_IO −0.3 V to +0.3 V PGND to GND_IO −0.3 V to +0.3 V Digital Input Voltage to GND_IO −0.3 V to VDD_IO + 0.3 V Analog Outputs to AGND −0.3 V to VAA Storage Temperature Range (TS) −65°C to +150°C Junction Temperature (TJ) 150°C Lead Temperature (Soldering, 10 sec) 260°C 1 Analog output short circuit to any power supply or common can be of an indefinite duration. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The ADV7342/ADV7343 are high performance integrated circuits with an ESD rating of <1 kV, and it is ESD sensitive. Proper precautions should be taken for handling and assembly. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 12. Thermal Resistance1 Package Type θJA θJC Unit 64-Lead LQFP 47 11 °C/W 1 Values are based on a JEDEC 4 layer test board. The ADV7342/ADV7343 are Pb-free products. The lead finish is 100% pure Sn electroplate. The devices are RoHS compliant, suitable for Pb-free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20). They are backward-compatible with conventional SnPb soldering processes. The electroplated Sn coating can be soldered with Sn/Pb solder paste at conventional reflow temperatures of 220°C to 235°C. ESD CAUTION |
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