MUR550APF, MURD550PF, MUR550PF

http://onsemi.com

3

Lead Length, L (IN)

Mounting

Method

1/8

1/4

1/2

Units

1

2

3

50

58

51

53

59

61

28

°C/W

°C/W

°C/W

Data shown for thermal resistance junction−to−ambient

guideline values for preliminary engineering or in case the

tie point temperature cannot be measured.

NOTE 2 — AMBIENT MOUNTING DATA

MOUNTING METHOD 1

MOUNTING METHOD 2

MOUNTING METHOD 3

3/4

55

63

L

L

P.C. Board Where Available Copper

Surface area is small.

L

L

Vector Push−In Terminals T−28

L = 1/2

Board Ground Plane

″

P.C. Board with

1−1/2

″ x 1−1/2″ Copper Surface