October 1992

9

Philips Semiconductors

Product specification

UHF push-pull power MOS transistor

BLF545

2. The striplines are on a double copper-clad printed circuit board, with glass microfibre reinforced PTFE (

3. Semi-rigid cables L2 and L25 are soldered on to striplines L1 and L26.

4. Striplines L6 and L7 are used in series with a 42

Ω stripline (11 × 3 mm).

Fig.12 Component layout for 500 MHz class-B test circuit.

The circuit and components are situated on one side of the printed circuit board, the other side being fully

metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow

rivets for a direct contact between upper and lower sheets.

Dimensions in mm.

handbook, full pagewidth

MBK462

L3

C3

C1

C4

C5

L4

L5

L6

L7

C10

C12

C18

C11

C16

C15

R3

R5

R4

R7 R8

R9 R6

R13

R17

+VD

+VD

R3

C9

C8

C14

L12

L13

R4

L11

L10

L14

C19

C20

C21, C22

L21

L20

L23

L22

L26

C23

C24

L15

L18

L19

L16

L17

L9

L8

C6

C7

C2

R1

L1

+ L2

L24

+ L25

85

82

103

mounting screw

mounting screw

rivet

strap

straps