1998 Jan 29

9

Philips Semiconductors

Product specification

UHF power MOS transistor

BLF404

Fig.11 Printed-circuit board and component layout for 500 MHz class-AB test circuit in Fig.10.

The components are situated on one side of the copper-clad printed-circuit board, the other side is unetched and serves as a ground plane.

Earth connections from the component side to the ground plane are made by through metallization.

Dimensions in mm.

handbook, full pagewidth

MGM524

R3

C13

C10

C11

C1

C2

C4

C5

C7

C8

C9

C12

3

1

2

+VD

C3

R4

R5

L1

L2

L3

L4

L5

L6

L8

L7

L9

L10

L11

31

56

R1

R6

R2

C6