OPA837IDBVT datasheet(5/63 Pages) TI

5 / 63 page

OPA837, OPA2837

www.ti.com

SBOS673D – SEPTEMBER 2017 – REVISED DECEMBER 2018

Product Folder Links: OPA837 OPA2837

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Staying below this ± supply turn-on edge rate prevents the edge-triggered ESD absorption device across the supply pins from turning

on.

(3)

Long-term continuous output current for electromigration limits.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VS– to VS+

Supply voltage

5.5

Supply turn-on/off maximum dV/dT(2)

V/µs

Input voltage

VS– – 0.5

VS+ + 0.5

VID

Differential input voltage

±1

Continuous input current

±10

Continuous output current(3)

±20

Continuous power dissipation

See Thermal Information:

OPA837

Maximum junction temperature

150

°C

Operating free-air temperature

–40

125

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS+

Single-supply voltage

2.7

5.4

Ambient temperature

–40

125

°C

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