STTH3R02QRL datasheet(2/9 Pages) STMICROELECTRONICS

2 / 9 page

Characteristics

STTH3R02

2/9

Characteristics

To evaluate the conduction losses use the following equation:

P = 0.68 x IF(AV) + 0.04 IF

(RMS)

Table 1.

Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)

Symbol

Parameter

Value

Unit

VRRM

Repetitive peak reverse voltage

200

IFRM

Repetitive peak forward current(1)

tp = 5 µs, F = 5 kHz

110

IF(RMS)

RMS forward current

DO-201AD / DO-15

SMC

IF(AV)

Average forward current,

δ = 0.5

DO-15 Tlead = 50° C

DO-201AD Tlead = 90° C

SMC Tc = 110° C

IFSM

Surge non repetitive forward current

tp = 10 ms Sinusoidal

Tstg

Storage temperature range

-65 to + 175

° C

Maximum operating junction temperature(1)

175

° C

Maximum lead temperature for soldering during 10 s at 4 mm from case

230

° C

On infinite heatsink with 10 mm lead length

Table 2.

Thermal parameters

Symbol

Parameter

Value

Unit

Rth(j-l)

Junction to lead

Lead Length = 10 mm on infinite heatsink

DO-15

° C/W

DO-201AD

Rth(j-c)

Junction to case

SMC

Table 3.

Static electrical characteristics

Symbol

Parameter

Test conditions

Min.

Typ

Max.

Unit

(1)

Reverse leakage current

Tj = 25° C

VR = VRRM

µA

Tj = 125° C

(2)

Forward voltage drop

Tj = 25° C

IF = 9 A

1.20

Tj = 25° C

IF = 3 A

0.89

1.0

Tj = 100° C

0.76

0.85

Tj = 150° C

0.70

0.80

Pulse test: tp = 5 ms, δ < 2 %

Pulse test: tp = 380 µs, δ < 2 %

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