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STM32H7 bảng dữ liệu(PDF) 345 Page - STMicroelectronics

tên linh kiện STM32H7
Giải thích chi tiết về linh kiện  32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB flash, up to 1MB RAM, 46 com. and analog interfaces
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STM32H7 bảng dữ liệu(HTML) 345 Page - STMicroelectronics

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DS12110 Rev 10
345/357
STM32H742xI/G STM32H743xI/G
Package information
348
Figure 135. TFBGA240+25 - Footprint example
8.10
Thermal characteristics
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × ΘJA)
Where:
•
TA max is the maximum ambient temperature in ° C,
•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 229. TFBGA240+25 - Example of PCB design rules
Dimension
Values
Pitch
0.8 mm
Dpad
0.300 mm
Dsm
0.400 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.400 mm
Stencil thickness
0.100 mm
BGA_WLCSP_FT_V1
Dsm
Dpad



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