STM32H7 datasheet(241/357 Pages) STMICROELECTRONICS

241 / 357 page

DS12110 Rev 10

241/357

STM32H742xI/G STM32H743xI/G

Electrical characteristics (rev V)

320

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device is monitored while a simple application,

executing EEMBC code, is running. This emission test is compliant with SAE IEC61967-2

standard which specifies the test board and the pin loading.

Table 153. EMI characteristics for fHSE = 8 MHz and fCPU = 400 MHz

Symbol Parameter

Conditions

Monitored

frequency band

Value

Unit

SEMI

Peak (1)

VDD = 3.6 V, TA = 25 °C, UFBGA240

package, compliant with IEC61967-2

0.1 MHz to 30 MHz

dBµV

30 MHz to 130 MHz

130 MHz to 1 GHz

1 GHz to 2 GHz

Level (2)

0.1 MHz to 2 GHz

2.5

1. Refer to AN1709 “EMI radiated test” chapter.

2. Refer to AN1709 “EMI level classification” chapter.

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