2003 May 01

3

NXP Semiconductors

Product data sheet

Schottky barrier diode

BAT960

THERMAL CHARACTERISTICS

Notes

1.

Refer to SOT666 standard mounting conditions.

2.

Mounted on printed circuit-board, 1 cm2 copper area.

Soldering

The only recommended soldering method is reflow soldering.

CHARACTERISTICS

Tamb = 25 °C unless otherwise specified.

Notes

1.

Only valid, if pins 1, 2, 5 and 6 are soldered on a 1 cm2 copper solder land.

2.

Pulse test: tp = 300 μs; δ = 0.02.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-a

thermal resistance from junction to ambient

note 1

405

K/W

note 2

215

K/W

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

VF

continuous forward voltage

IF = 10 mA

240

270

mV

IF = 100 mA

300

350

mV

IF = 1000 mA; note 1; see Fig.2 480

550

mV

IR

reverse current

VR = 5 V; note 2

5

10

μA

VR = 8 V; note 2

7

20

μA

VR = 15 V; note 2; see Fig.3

10

50

μA

Cd

diode capacitance

VR = 5 V; f = 1 MHz; see Fig.4

19

25

pF