AD8392A

Rev. 0 | Page 11 of 12

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-AET

28

15

14

1

EXPOSED

PAD

(Pins Up)

9.80

9.70

9.60

4.50

4.40

4.30

6.40

BSC

TOP VIEW

BOTTOM VIEW

0.65 BSC

0.15

0.05

COPLANARITY

0.10

1.20 MAX

1.05

1.00

0.80

0.30

0.19

SEATING

PLANE

0.20

0.09

3.05

3.00

2.95

8°

0°

0.75

0.60

0.45

3.55

3.50

3.45

Figure 21. 28-Lead Thin Shrink Small Outline with Exposed Pad [TSSOP/EP]

(RE-28-1)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

1

32

8

9

25

24

16

17

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

Figure 22. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad (CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8392AAREZ1

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP/EP)

RE-28-1

AD8392AAREZ-RL1

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP/EP)

RE-28-1

AD8392AAREZ-R71

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP/EP)

RE-28-1

AD8392AACPZ-R21

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8392AACPZ-RL1

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8392AACPZ-R71

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2