ICS671-01

ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER

ZDB AND MULTIPLIER

IDT™ / ICS™ ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER

4

ICS671-01

REV F 051310

AC Electrical Characteristics

VDD = 3.3V ±10%, Ambient Temperature 0 to +70

° C, CLOAD at CLK = 15 pF, unless stated otherwise

Note 1: With CLKIN = 20 MHz, FBIN to CLK8, all outputs at 40 MHz.

Note 2:With CLKIN = 80 MHz, FBIN to CLK8, all outputs at 160 MHz.

Note 3: These specs do not apply to mode 01.

Thermal Characteristics (16 pin SOIC)

Ouput Low Voltage

VOL

IOL = 25mA

0.4

V

Output High Voltage,

CMOS level

VOH

IOH = -8 mA

VDD-0.4

V

Operating Supply Current

IDD

No Load, S1 = 1, S0 = 0,

Note 1

25

mA

No Load, S1 = 1, S0 =0

Note 2

Power Down Supply

Current

IDDPD

CLKIN = 0, S0 = 0, S1 = 0

500

µA

Short Circuit Current

IOS

Each output

±50

mA

Input Capacitance

CIN

S0, S1, FBIN

7

pF

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Input Clock Frequency

fIN

See table on page 2

5

80

MHz

Output Clock Frequency

See table on page 2

5

160

MHz

Output Rise Time

tOR

0.8 to 2.0V, CL=30 pF

1.5

ns

Output Fall Time

tOF

2.0 to 0.8V, CL=30 pF

1.5

ns

Output Clock Duty Cycle

tDC

measured at VDD/2

40

50

60

%

Device to Device Skew

rising edges at VDD/2, Note 3

700

ps

Output to Output Skew

rising edges at VDD/2, Note 3

250

ps

Input to Output Skew

rising edges at VDD/2, FBIN to

CLK8

±350

ps

Maximum Absolute JItter

15 pF

300

ps

Cycle to Cycle Jitter

30 pF loads

500

ps

PLL Lock Time

Note 3

1.0

ms

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Thermal Resistance Junction to

Ambient

θJA

Still air

120

° C/W

θJA

1 m/s air flow

115

° C/W

θJA

3 m/s air flow

105

° C/W

Thermal Resistance Junction to Case

θJC

58

° C/W