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RB520CS30L

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Product data sheet

Rev. 1 — 10 March 2011

3 of 14

Nexperia

RB520CS30L

100 mA low VF MEGA Schottky barrier rectifier

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[2]

Tj =25 °C prior to surge.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[4]

Reflow soldering is the only recommended soldering method.

[5]

Device mounted on a ceramic PCB, Al2O3, standard footprint.

6.

Thermal characteristics

[1]

For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse

power losses PR are a significant part of the total power losses.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[4]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[5]

Device mounted on a ceramic PCB, Al2O3, standard footprint.

[6]

Soldering point of cathode tab.

Tj

junction temperature

-

150

°C

Tamb

ambient temperature

−65

+150

°C

Tstg

storage temperature

−65

+150

°C

Table 5.

Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

[1][2]

[3] -

-

395

K/W

[4] -

-

220

K/W

[5] -

-

145

K/W

Rth(j-sp)

thermal resistance from

junction to solder point

[6] --70

K/W