ISL98607

2. Specifications

FN8421 Rev.1.00

Page 5 of 29

Jun.3.19

2.

Specifications

2.1

Absolute Maximum Ratings

2.2

Thermal Information

2.3

Recommended Operation Conditions

Parameter

Minimum

Maximum

Unit

VBST, VBSTCP, CP, VP to AGND

-0.3

7

V

VN, VSUB to AGND

+0.3

-7

V

VIN, SCL, SDA, ENN, ENP to AGND

-0.3

6

V

LXP to AGND

-0.3

VBST + 0.3

V

CN to AGND

VN - 0.3

PGND + 0.3

V

Maximum Average Current Out of VBST Pin

1

A

Maximum Average Current Into LXP Pin

1

A

Maximum Average Current Into CN, CP Pin

-1

A

ESD Rating

Value

Unit

Human Body Model (Tested per JESD22-A114)

2

kV

Machine Model (Tested per JESD22-A115)

200

V

Charged Device Model (Tested per JESD22-C101)

750

V

Latch-Up (Tested perJESD78; Class II, Level A)

100

mA

Thermal Resistance (Typical)

θJA (°C/W)

θJC (°C/W)

4x5 Bump 0.4mm pitch WLCSP (

Notes 5, 6)66

0.95

20 Ld 3x4 TQFN (Notes 5, 7)48

16

Notes:

5. θJA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features.

See TB379.

6. For θJC, the “case temp” location is taken at the package top center.

7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature

+125

°C

Storage Temperature Range

-65

+150

°C

Pb-Free Reflow Profile

see TB493

Parameter

Minimum

Maximum

Unit

Ambient Temperature Range

-40

+85

°C

VIN

2.8

4.4

V

VP

+5

+5.7

V

VN

-5

-5.7

V

VBST

+5.15

+6.0

V

Output Current Maximum (between VP and VN)

100

mA