MIC24066/7

DS20006730A-page 8

 2022 Microchip Technology Inc. and its subsidiaries

PG Low State Voltage

VPG_L

—70

200

mV

VFB < 90% × VNOM, IPG = 1 mA

PG Leakage Current

ILEAK(PG)

——

100

nA

VPG = 5.5V

Thermal Shutdown

Thermal Shutdown Threshold

TSD

—

160

—

°C

TJ rising

Thermal Shutdown Hysteresis

TSD_HYS

—

20

—

°C

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: PVIN = SVIN = 12V, VOUT = 1.2V, VBST – VSW = 5V; TA = 25°C, unless noted. Bold values

indicate 40°C ≤ TJ ≤ +125°C.

Parameters

Symbol

Min.

Typ. Max. Units

Conditions

Note 1: Exceeding the absolute maximum rating may damage the device.

2: Devices are ESD Sensitive. Handling precautions recommended. Human body model: 1.5 kΩ in series

with 100 pF.

3: The device is not guaranteed to function outside its operating range.

4: PD(MAX) = (TJ(MAX) - TA) /θJA, where θJA depends upon the printed circuit layout. A 5 square inch 4 layer,

0.62'', FR-4 PCB with 2 oz finish copper weight per layer is used for the θJA.

5: Measured in test mode.

6: The maximum duty-cycle is limited by the fixed mandatory off-time of typically 300 ns.

TEMPERATURE SPECIFICATIONS

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

TJ

-40

—

+125

°C

Note 1

Maximum Junction Temperature

TJ(ABSMAX)

——

+150

°C

Storage Temperature Range

TS

-65

—

+150

°C

Lead Temperature

TLEAD

—

—

+300

°C

Soldering, 10s

Package Thermal Resistance

Thermal Resistance, 5 mm x 6 mm,

36-Lead VQFN

JB

—

10.2

—

°C/W

Junction to Board

JC(Top)

—

31.2

—

°C/W

Junction to Case (Top)

JA

—

33.7

—

°C/W

Junction to Ambient

JT

—

11.1

—

°C/W

Junction to Top

JB

—

11.8

—

°C/W

Junction to Bot

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.