HC705MC4GRSSLASHD datasheet(165/180 Pages) NXP

165 / 180 page

Electrical Specifications

Functional Operating Range

General Release Specification

Electrical Specifications

14.4 Functional Operating Range

14.5 Thermal Characteristics

Table 14-2. Operating Range

Characteristic

Symbol

Value

Unit

Operating Temperature Range

MC68HC705MC4P, DW, S (Standard)

MC68HC705MC4CP, CDW, CS (Extended)

MC68HC705MC4VP, VDW, VS (Automotive)

MC68HC705MC4MP, MDW, MS(Automotive)

TL to TH

0 to 70

–40 to 85

–40 to 105

–40 to 125

°C

Operating Voltage Range

VDD

5.0

± 10%

Table 14-3. Thermal Characteristics

Characteristic

Symbol

Value

Unit

Thermal Resistance

Plastic (28 Pin)

SOIC (28 Pin)

°C/W

I/O Pin Power Dissipation

PI/O

User Determined

Power Dissipation(1)

PD = (IDD x VDD) + PI/O =

K/(TJ + 273 °C)

Constant(2)

PD x(TA + 273 °C)

+ PD

2 x

°C

Average Junction Temperature

TA + (PD x θJA)

°C

Maximum Junction Temperature

TJM

125

°C

NOTES:

1. Power dissipation is a function of temperature.

2. K is a constant unique to the device. K can be determined for a known TA and

measured PD. With this value of K, PD and TJ can be determined for any value of TA.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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