Markings and Case Diagrams

MC44BC375/U/J/T Technical Data

15.2 Packaging Instructions

Tape and reel packaging per 12MRH00360A with the following conditions applicable for Dual In-Line

SOP (SOIC) package.

15.3 Marking Instructions

In accordance with 12MRH00191A internal specification applied for Dual in-line SO package.

Component Orientation: Arrange parts with the pin 1

side closest to the tape's round sprocket holes on the

tape's trailing edge.

•1st line:

MC44BC375U for MC44BC375UD device

MC44BC375J for MC44BC375JD device

MC44BC375T for MC44BC375TD device

(Part number coded on 10 digits)

•

2nd line:

Assembly site code AW (2 digits) followed by the

wafer lot code L (1 digit),

year Y (1 digit) and

work week WW (2 digits)

Bar marked part way accross Pin 1 end of package.

Bar width 10 to 20 mils, length to be at least four

times Bar width. Bar placement may extend across

chamfer and dimple areas.

Pin 1 Dot or Dimple

MC44BC375x

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com