HIP4080IP datasheet(20/21 Pages) RENESAS

20 / 21 page

HIP4080

FN3178 Rev 11.00

Page 20 of 21

February, 2003

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section

2.2 of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.25mm (0.010

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch

dimensions are not necessarily exact.

INDEX

AREA

-B-

0.25(0.010)

C A

B S

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45o

0.25(0.010)



M20.3 (JEDEC MS-013-AC ISSUE C)

20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.0926

0.1043

2.35

2.65

0.0040

0.0118

0.10

0.30

0.013

0.0200

0.33

0.51

0.0091

0.0125

0.23

0.32

0.4961

0.5118

12.60

13.00

0.2914

0.2992

7.40

7.60

0.050 BSC

1.27 BSC

0.394

0.419

10.00

10.65

0.010

0.029

0.25

0.75

0.016

0.050

0.40

1.27

N20



Rev. 0 12/93

Small Outline Plastic Packages (SOIC)

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